Drill report for GC1-RevD.kicad_pcb
Created on 2026-09-09T22:24:32

Copper Layer Stackup:
    =============================================================
    L1 :  F.Cu                      front
    L2 :  In1.Cu                    in1
    L3 :  In2.Cu                    in2
    L4 :  B.Cu                      back


Drill file 'GC1-RevD-PTH.drl' contains
    plated through holes:
    =============================================================
    T1  0.300mm  0.0118"  (109 holes))
    T2  0.400mm  0.0157"  (5 holes))
    T3  1.400mm  0.0551"  (8 holes))

    Total plated holes count 122


Drill file 'GC1-RevD-NPTH.drl' contains
    unplated through holes:
    =============================================================
    T1  2.200mm  0.0866"  (3 holes))

    Total unplated holes count 3
